Electronic x-ray inspection is a system that will display images which are gray-scale. These images will represent differences in thickness and shape of the particular object. Objects which have a high density will produce darker images than objects which have a lesser thickness or density. This measurement will help establish unacceptable or acceptable conditions for manufacturing processes.
In the process of an electronic x-ray inspection, x-rays will come from the source which then passes a circuit board onto an Intensifier Image. These images direct themselves through a mirror onto a video camera. The images which are digitized are then sent onto a processor for images where they are displayed for analysis.
These types of systems are used for fully automatic or manual defect detection and inspection. The x-rays can reveal a variety of defects such as shorted or open solder joints, chip tombstoning, lift leads, unacceptable variations in size relating to solder bumps, component mis-registration, opens and bridging and component misalignment.
Industrial electronic x-ray inspections operate with PCBA (Printed Circuit Board Assembly). This operation allows for real time in monitoring for variables found in manufacturing, this leads to problems been solved in a much faster way. The accumulation of this information can ensure that these components can be corrected and the cause of the defect can be found.
Manual systems used will provide an analytical examination, while automated systems provide repeatability. The expense of the two is differential, as the automated system will cost more due to the processing power needed and the mechanical assembly.
X-rays are much needed in today’s PCB’s which have become increasingly densely populated by the use of other components. The use of an electronic x-ray system such as XT V (160) produces a high quality inspection which can be used in a cost effective manner. The system targets failure analysis and production facilities used in laboratories.
Inspections that use an automated system can inspect samples of the highest throughput. While manual systems can enable the relevant operators to evaluate and visualize the smallest of internal deficiencies and defects.
Features of the electronic x-ray inspection:
-High quality in imaging
-Efficient data capture
-Large tray in order to load many boards at once
-Customizable macros which will automate the measurements in work-flow
-Focal size of submicron
-A station available for remote validation
Applications of the electronic x-ray inspection:
-Analysis in BGA connectivity
-Calculation in solder void
-Analysis in ball bond
-Analysis in solder reflow
-Inspection and measurements of holes
-Micro BGA Analysis of pad array
-Analysis and detection of dry joints
The benefits of using an electronic x-ray inspection will mean you are offered with flexibility within one system. The inspection is fully automated allowing for interactive visualization. The inspections will be efficient and cost you little in terms of maintenance.
This system is kind on the environment and requires no special badges or special precautions. This system could end up saving you thousands of dollars in manufacturing processes, by finding undetectable problems in components.